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Solder
Paste Height Measurement System (SPM-300-3D) with 3D inspection |
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Caltex Solder Paste Height Measurement System (SPM-300) is the low-cost QC
solution for SMT manufacturing. One system with two functions: solder
paste height measurement and video inspection & taking pictures. With zoom 50x-300x, the system is
capable of measuring height or depth down to 0.001", plus measuring solder mask,
trace, pads, pitch and through holes. When inspection is called for, 50x-300x
zoom plus digital-video imaging on your PC is so easy on the eyes and so quick
to capture defect images and email right from your computer. The system is both
economical as well as easy to use for any SMT production floor. This tool is
ideal for measuring solder paste to gain better printing process as well as
quality inspection for post re-flow solder joints. |
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 Solder
Paste Measurement System SPM-300-3D |
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The system is completed with mega
pixel digital camera, zoom
optic 50x-300x, laser light, rotational view and measurement software for your
Windows/Pentium computer. |
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Key Benefits: |
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True digital-video
system for measurement, inspection, taking pictures, documentation, and email
for SMT industry
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Measurement software &
laser light for solder paste height measurement with simple mouse clicks
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Easy to use
measurement for X-Y, Z height, radius, diameter, area, path length for lead
pitch, through holes, components
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High accuracy
measurement of 0.001 inch with 2 micron accuracy.
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Compare images with
image library files
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Use the same system
for multiple department: process, production, QC, failure analysis lab, R&D
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Wide zoom range
50x-300x (upgradeable to 20x-800x)
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3D Rotational
inspection add-on for solder joints, solder paste, and QFP leads
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Three functions in one system:
solder paste measurement, BGA inspection
measurement, and 3D rotational inspection
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Low cost, easy to
use, latest digital-video technology. |
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Caltex 3D Solder
Paste Measurement (SPM-300-3D) system configuration: |
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Color CCD camera and digital
video interface for direct
connect to computer
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Zoom lens 50x-300x with laser
light for height measurement
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Integrated fiber optic lighting
for critical inspection
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High accuracy, easy-to-use
measurement software for measuring height, pad, trace, pitch...(Windows
Vista/XP)
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Multi-position system boom stand
with tilting mount for angle view,
for large circuit board
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Optional 3D rotational 45° viewing
add-on
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Optional BGA Scope 90°
inspection add-on
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Optional mega pixel
digital color camera (1.4, 2.0, 3.0 mega pixel)
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| How
it works: |
| The SPM-300 projects a thin slice of laser light through a focusing lens onto the solder
paste. This extremely thin slice of laser light intersects the top portion of solder paste
first before reaching the board, which produces an offset of two lines due to height
difference. Since this laser light is aligned at 45 degree, the profile of lines is in (1:1) one to one correspondent with the Z-Axis (Height Profile) of
solder paste being measured. One then just measure the distance between these two lines to
obtain Z-Height data. One can also measure any X-Y distances and Area on the solder paste
to calculate for volume. |
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Actual sample images: |
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3D, 45 degree angle view, at 150x
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3D, 45 degree angle view, at 250x
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3D rotational view of solder paste
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solder paste height measurement with laser light
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solder paste measurement
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live video viewing on PC, with thumbnail image archive
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live video in measurement software
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