Solder Bump on Wafer (300x with 45 degree oblique angle view)
Wire bonding on Hybrid (200x with 45 degree oblique view)
Wire bonding (400x with 45 degree oblique angle view)
Probe card tips inspection, measurement, and characterization
Partial List of 3-D Hi-Scope Customers:
Motorola, Intel, AMD, National Semiconductor, Cypress Semiconductor, Elmo Semiconductor, Hughes Electronics, etc.
email us: Copyright © 2000-2007 Caltex Scientific Inc. All rights reserved. Last modified: 02/04/2008
Solder Bump on Wafer (300x with 45 degree
oblique angle view)
Wire bonding on Hybrid (200x with 45 degree
oblique view)
Wire bonding (400x with 45 degree oblique
angle view)
Probe card tips inspection, measurement,
and characterization