|
|
|
cold BGA solder joint
|
|
|
|
crack at 2nd row inside
|
|
|
|
crack at 3rd row inside
|
|
|
|
fine cracks at BGA solder joints
|
|
|
|
elongated BGA joints
|
|
|
|
|
elongated BGA ball joints
|
|
|
|
lifted BGA ball from pad
|
|
|
|
deformed joint
|
|
|
|
detect crack inside row of BGA
|
|
|
|
failure analysis of BGA
|
|
|
|
|
with back lighting, it is easy to inspect solder bridge & short
|
|
|
|
actually see fine crack at solder pad that no X-ray system can detect
|
|
|
|
Measure ball diameter, radius, height, pitch, and angle with measurement software
|
|
|