BGA package has presented a challenge to SMT professionals. The space in between components is often small, the package height is usually 0.02 inch or even 0.005 inch, and the ball sizes are getting smaller and smaller. No single technique can uncover all the defect types. With this in mind, Hirox Optics has developed the brand new and ingenious BGA Scope system, an optical inspection technique to solve this challenging problem; and come up with a solution not only easier to use, better image, but also lower cost than most X-Ray and microscope systems.

sample thumbnail images of Digital-Video image workstation

with back lighting, it is extremely easy to check for solder bridging between balls.

Such a fine crack can only be uncovered with BGA Scope optical (visual) system, not by X-Ray.

Easy to measure Ball diameter, height, pitch, angle, and radius.

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