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The applications and industries that we serve:

Fine-Pitch-animation.GIF (104107 bytes)

New! BGA and Micro BGA application

Surface Mounting Technologies
inspecting fine pitch, J-lead, and SMD for cold solder joint, and never miss a defect
Bare Board Inspection
inspecting plated through hole without cross sectioning, measure trace and mask on bare board
Semiconductor
wafer bump characterization, wire bond failure analysis, IC wafer level, and probe mark on pad
Failure Analysis
from metal fracture to paint surface, from SMT to microelectronics
Dermatology
hair, scalp, skin, whisker
Laboratory
from granule to power, from plastic to diaper, from detergent to filter
Forensic
trace evidence analysis and digital video imaging
Metallurgic
handheld metallurgic video microscope with bright field or dark field imaging

Partial List of our Customers:

Lockheed Martin, Northrop Grumman, Solectron, Boeing, Hewlett-Packard, Sun Micro, TI, Hughes, Toshiba, Seagate, Flextronic
Intel, Motorola, AMD, National Semiconductor, Cypress Semiconductor, Micron Technology,
Medtronic, St. Jude Medical, Proctor and Gamble, Neutrogena, Johnson & Johnson, Millipore, Guidant,

 

                   

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Last modified: 02/04/2008